Charles Whyte

Corporate Officer/Principal presso Vertical Circuits, Inc.

Electronic Technology

Consumer Services

Profilo

Charles Whyte is currently the Vice President-Product & Test Engineering at Vertical Circuits, Inc. He was previously a Principal at SanDisk LLC.
He graduated from The University of Edinburgh with a graduate degree and also holds an MBA from Santa Clara University.

Posizioni attive di Charles Whyte

Società	Posizione	Inizio
Vertical Circuits, Inc. Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products.	Corporate Officer/Principal	-

Tutte le posizioni attive di Charles Whyte

Precedenti posizioni note di Charles Whyte

Società	Posizione	Fine
SANDISK CORPORATION	Corporate Officer/Principal	-

Vedi nel dettaglio l'esperienza di Charles Whyte

Formazione di Charles Whyte

The University of Edinburgh	Graduate Degree
Santa Clara University	Masters Business Admin

Esperienze
Posizioni ricoperte

Attive

Inattive

Società quotate in Borsa

Aziende private

Vedi nel dettaglio l'esperienza di Charles Whyte

Relazioni

Relazioni di 1° grado

Aziende connesse in 1º grado

Uomo

Donna

Amministratori

Dirigenti

Vedi i contatti personali

Società collegate

Aziende private	2
Vertical Circuits, Inc. Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products.	Electronic Technology
SanDisk LLC SanDisk LLC Computer PeripheralsElectronic Technology SanDisk LLC designs, develops and markets flash memory data storage products. The company was founded by Eli Harari and Sanjay Mehrotra on June 01, 1988 and is headquartered in Irvine, CA.	Electronic Technology