Hong Feng Liu
Public Communications Contact presso BOE TECHNOLOGY GROUP COMPANY LIMITED
Patrimonio netto: 853 579 $ in data 31/03/2024
Profilo
Hong Feng Liu is currently the Director at Beijing Nissin Electronics Precision Component Co. Ltd.
and the Board Secretary & Vice President at BOE Technology Group Co., Ltd.
Prior to his current positions, he graduated from Beihang University.
Partecipazioni note in società pubbliche
| Società | Data | Numero di azioni | Valorizzazione | Data di valutazione |
|---|---|---|---|---|
| 30/06/2023 | 1 024 500 ( 0.00% ) | 575 513 $ | 31/03/2024 | |
| 30/06/2023 | 495 000 ( 0.16% ) | 278 066 $ | 31/03/2024 |
Posizioni attive di Hong Feng Liu
| Società | Posizione | Inizio |
|---|---|---|
| BOE TECHNOLOGY GROUP COMPANY LIMITED | Public Communications Contact | - |
Beijing Nissin Electronics Precision Component Co. Ltd.
 Beijing Nissin Electronics Precision Component Co. Ltd. Miscellaneous ManufacturingProducer Manufacturing Beijing Nissin Electronics Precision Component Co. Ltd. is a private company that manufactures metal stampings. The company is based in Beijing, China. | Director/Board Member | - |
Formazione di Hong Feng Liu
| Beihang University | Graduate Degree |
Esperienze
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Relazioni
Relazioni di 1° grado
Aziende connesse in 1º grado
Uomo
Donna
Amministratori
Dirigenti
Società collegate
| Società quotate in Borsa | 1 |
|---|---|
| BOE TECHNOLOGY GROUP COMPANY LIMITED | Electronic Technology |
| Aziende private | 1 |
|---|---|
Beijing Nissin Electronics Precision Component Co. Ltd.
Beijing Nissin Electronics Precision Component Co. Ltd. Miscellaneous ManufacturingProducer Manufacturing Beijing Nissin Electronics Precision Component Co. Ltd. is a private company that manufactures metal stampings. The company is based in Beijing, China. | Producer Manufacturing |
- Borsa valori
- Insiders
- Hong Feng Liu
