![Jung Sheng Li](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Jung Sheng Li
Presidente presso
Kun Hong Business Co. Ltd.
Profilo
Jung Sheng Li is currently the President of Kun Hong Business Co. Ltd. Prior to this, he worked as a Director at Chipbond Technology Corp.
from 1997 to 2012.
He obtained an undergraduate degree from Fu Jen Catholic University.
Posizioni attive di Jung Sheng Li
| Società | Posizione | Inizio |
|---|---|---|
Kun Hong Business Co. Ltd.
 Kun Hong Business Co. Ltd. Auto Parts: OEMProducer Manufacturing Manufactures and exports auto parts and accessories | Presidente | - |
Precedenti posizioni note di Jung Sheng Li
| Società | Posizione | Fine |
|---|---|---|
| CHIPBOND TECHNOLOGY CORPORATION | Direttore/Membro del Consiglio | - |
Formazione di Jung Sheng Li
Esperienze
Posizioni ricoperte
Attive
Inattive
Società nel listino
Aziende private
Relazioni
19
Relazioni di 1° grado
3
Aziende connesse in 1º grado
Uomo
Donna
Amministratori
Dirigenti
Società collegate
| Aziende private | 3 |
|---|---|
Chipbond Technology Corp.
 Chipbond Technology Corp. SemiconductorsElectronic Technology Manufactures and distributes wafer bumps, chips, and other electronic components | Electronic Technology |
Kun Hong Business Co. Ltd.
Kun Hong Business Co. Ltd. Auto Parts: OEMProducer Manufacturing Manufactures and exports auto parts and accessories | Producer Manufacturing |
Fu Jen Catholic University
 Fu Jen Catholic University Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
