![Henk-Jan Jonge Poerink](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Henk-Jan Jonge Poerink
Direttore operativo presso BE SEMICONDUCTOR INDUSTRIES N.V.
Profilo
Attualmente, Henk-Jan Jonge Poerink ricopre la posizione di Senior Vice President-Global Operations presso BE Semiconductor Industries NV e di Managing Director presso Besi APac Sdn. Bhd. (una filiale di BE Semiconductor Industries NV).
Posizioni attive di Henk-Jan Jonge Poerink
Società | Posizione | Inizio |
---|---|---|
BE SEMICONDUCTOR INDUSTRIES N.V. | Direttore operativo | 01/02/2010 |
Besi APac Sdn Bhd
![]() Besi APac Sdn Bhd Electronics DistributorsDistribution Services Part of BE Semiconductor Industries NV, Besi APac Sdn Bhd is a Malaysian company that specializes in providing the most accurate single supplier substrate sawing machine in the market. The company is based in Shah Alam, Malaysia, and is led by CEO Henk-Jan Jonge Poerink. The company's flagship product, the FSL, is highly recommended for its precision and accuracy. The company also offers the new ESEC 2100 SD Advanced I with device height sensor and high precision bond head, which boasts impressive properties. | Amministratore Delegato | - |
Esperienze
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Relazioni
Relazioni di 1° grado
Aziende connesse in 1º grado
Uomo
Donna
Amministratori
Dirigenti
Società collegate
Società quotate in Borsa | 1 |
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BE SEMICONDUCTOR INDUSTRIES N.V. | Producer Manufacturing |
Aziende private | 1 |
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Besi APac Sdn Bhd
![]() Besi APac Sdn Bhd Electronics DistributorsDistribution Services Part of BE Semiconductor Industries NV, Besi APac Sdn Bhd is a Malaysian company that specializes in providing the most accurate single supplier substrate sawing machine in the market. The company is based in Shah Alam, Malaysia, and is led by CEO Henk-Jan Jonge Poerink. The company's flagship product, the FSL, is highly recommended for its precision and accuracy. The company also offers the new ESEC 2100 SD Advanced I with device height sensor and high precision bond head, which boasts impressive properties. | Distribution Services |
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