Provenienza dei contatti di primo grado di Hisao Nishimura
Entità | Tipo di entità | Settore Industriale | |
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Bandick Corp.
Bandick Corp. Miscellaneous ManufacturingProducer Manufacturing Part of Towa Corp., Bandick Corp. is a Japanese semiconductor packaging solution company focused on meeting customer needs. The company specializes in a transfa system that uses fluid resin to protect semiconductor chips and sell molding devices using compression methods. The company's goal is to create a new future in the field of semiconductor packaging with a quarter lead and the world's most advanced technology. The company also offers a cbn end mill product with high accuracy, wear resistance, and long life.
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| Subsidiary | Miscellaneous Manufacturing | 1 |
Grafico delle società connesse in secondo grado
Relazione in diverse aziende
Società connesse a Hisao Nishimura tramite i suoi contatti personali
Società | Settore | Persone collegate | Posizione principale |
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Statistiche
Distribuzione geografica
Settori
Posizioni
Director/Board Member | 1 |
President | 1 |
Contatti più connessi
Insiders | |
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Tamotsu Akiyama | 1 |
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