![Bruce W. Hueners](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Bruce W. Hueners
Amministratore Delegato presso Palomar Technologies, Inc.
Profilo
Bruce W.
Hueners is currently the President & Chief Executive Officer at Palomar Technologies, Inc. He previously worked as a Principal at GE Aerospace.
He completed his undergraduate degree at the University of Southern California and holds an MBA from Indiana University.
Posizioni attive di Bruce W. Hueners
Società | Posizione | Inizio |
---|---|---|
Palomar Technologies, Inc.
![]() Palomar Technologies, Inc. Electronic Production EquipmentElectronic Technology Palomar Technologies, Inc. provides die attach systems and processes. It offers micro- and optoelectronic packaging and assembly systems and solutions, die and wire bonders, wire bonding technology, automated dispense and encapsulation systems, automated plasma cleaners, die ejectors and bond testing equipment, semi-automated and manual bonders, laser interferometers, automated production lines, refurbished systems, and bonder buy-back programs; and VisionPilot, a geometric pattern matching software for automated die attach. The company was founded in 1975 and is headquartered in Carlsbad, CA. | Amministratore Delegato | 01/01/2007 |
Precedenti posizioni note di Bruce W. Hueners
Società | Posizione | Fine |
---|---|---|
GE AEROSPACE | Corporate Officer/Principal | - |
Formazione di Bruce W. Hueners
Indiana University | Masters Business Admin |
University of Southern California | Undergraduate Degree |
Esperienze
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Relazioni
Relazioni di 1° grado
Aziende connesse in 1º grado
Uomo
Donna
Amministratori
Dirigenti
Società collegate
Società quotate in Borsa | 1 |
---|---|
GE AEROSPACE | Producer Manufacturing |
Aziende private | 1 |
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Palomar Technologies, Inc.
![]() Palomar Technologies, Inc. Electronic Production EquipmentElectronic Technology Palomar Technologies, Inc. provides die attach systems and processes. It offers micro- and optoelectronic packaging and assembly systems and solutions, die and wire bonders, wire bonding technology, automated dispense and encapsulation systems, automated plasma cleaners, die ejectors and bond testing equipment, semi-automated and manual bonders, laser interferometers, automated production lines, refurbished systems, and bonder buy-back programs; and VisionPilot, a geometric pattern matching software for automated die attach. The company was founded in 1975 and is headquartered in Carlsbad, CA. | Electronic Technology |
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