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Cheng Bin Zhang
Direttore Tecnico/Scientifico/R&S presso Henghui Technology Corp. Ltd.
Profilo
Cheng Bin Zhang is currently working as Manager-Research & Development at HENGHUI Technology Corp.
Ltd.
He completed his undergraduate degree from Qilu University of Technology.
Posizioni attive di Cheng Bin Zhang
Società | Posizione | Inizio |
---|---|---|
Henghui Technology Corp. Ltd.
![]() Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Direttore Tecnico/Scientifico/R&S | 01/01/2018 |
Formazione di Cheng Bin Zhang
Qilu University of Technology | Undergraduate Degree |
Esperienze
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Relazioni
Relazioni di 1° grado
Aziende connesse in 1º grado
Uomo
Donna
Amministratori
Dirigenti
Società collegate
Aziende private | 1 |
---|---|
Henghui Technology Corp. Ltd.
![]() Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Producer Manufacturing |
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