Provenienza dei contatti di primo grado di Takeshi Wakabayashi
Entità | Tipo di entità | Settore Industriale | |
---|---|---|---|
Casio Micronics Co., Ltd.
Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry.
4
| Subsidiary | Semiconductors | 4 |
Grafico delle società connesse in secondo grado
Relazione in diverse aziende
Società connesse a Takeshi Wakabayashi tramite i suoi contatti personali
Società | Settore | Persone collegate | Posizione principale |
---|---|---|---|
CASIO COMPUTER CO., LTD. | Electronics/Appliances | Director/Board Member |
Statistiche
Distribuzione geografica
Giappone | 2 |
Settori
Consumer Durables | 2 |
Posizioni
Director/Board Member | 5 |
Corporate Officer/Principal | 2 |
Independent Dir/Board Member | 1 |
Chief Administrative Officer | 1 |
Public Communications Contact | 1 |
Contatti più connessi
- Borsa valori
- Insiders
- Takeshi Wakabayashi
- Connessioni Società