Zhi Yi Xiao
Direttore/Membro del Consiglio presso UNISEM (M)
Relazioni attive
| Nome | Sesso | Età | Società collegate | Collaborazione |
|---|---|---|---|---|
| Mong Tet Chia | M | 73 |
Unisem Advanced Technologies Sdn. Bhd.
 Unisem Advanced Technologies Sdn. Bhd. SemiconductorsElectronic Technology Unisem Advanced Technologies Sdn. Bhd. manufactures electron tubes and semiconductors. Its services include gold bumping, electroplated solder bumping, electroplated copper pillar bumping, large solder bumping, PBO, polyimides & BCB passivation, redistribution of bond pads and in-house photo mask and stencil design capability. The company was founded on September 13, 2004 and is headquartered in Perak, Malaysia. | 35 anni |
| Chye Hock Ang | M | 74 | 23 anni | |
| Hoong Leong Lee | M | 67 |
Unisem Advanced Technologies Sdn. Bhd.
Unisem Advanced Technologies Sdn. Bhd. SemiconductorsElectronic Technology Unisem Advanced Technologies Sdn. Bhd. manufactures electron tubes and semiconductors. Its services include gold bumping, electroplated solder bumping, electroplated copper pillar bumping, large solder bumping, PBO, polyimides & BCB passivation, redistribution of bond pads and in-house photo mask and stencil design capability. The company was founded on September 13, 2004 and is headquartered in Perak, Malaysia. | 9 anni |
| Wei Bing Cui | M | 56 | 14 anni | |
| Sin Tet Chia | M | 75 |
Unisem Advanced Technologies Sdn. Bhd.
Unisem Advanced Technologies Sdn. Bhd. SemiconductorsElectronic Technology Unisem Advanced Technologies Sdn. Bhd. manufactures electron tubes and semiconductors. Its services include gold bumping, electroplated solder bumping, electroplated copper pillar bumping, large solder bumping, PBO, polyimides & BCB passivation, redistribution of bond pads and in-house photo mask and stencil design capability. The company was founded on September 13, 2004 and is headquartered in Perak, Malaysia. | 33 anni |
| David McComb | M | - |
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | 17 anni |
| Teh Muy Ch'ng | F | 53 | 2 anni | |
| Siew Eng Lim | F | 71 | 9 anni | |
| Wei Lü | M | 46 | 5 anni | |
| Ying Shi | F | 60 | 5 anni | |
| Hock Yee Chin | F | 58 | 25 anni | |
| Xie Kang Yu | M | 76 | 2 anni | |
| Feng Ju | M | 40 | 15 anni | |
| Chung Shin Khoo | M | 56 | 32 anni | |
| Yong Song | M | 61 |
Huatian Technology (Kunshan) Electronics Co. Ltd.
 Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | 17 anni |
| Wen Ying Chang | M | 58 |
Huatian Technology (Kunshan) Electronics Co. Ltd.
Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | 17 anni |
| Sheng Li Xiao | M | 78 |
Huatian Technology (Kunshan) Electronics Co. Ltd.
Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | 17 anni |
| Puan Nelleita Binti Omar | F | 49 | 2 anni | |
| Li Ping Zhang | M | 46 | 12 anni | |
| Dawn Cuevas | F | - |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | - |
| Qi Nan Zang | F | 33 | 1 anni | |
| Suan Hong Quek | M | 74 | 13 anni | |
| Choon Seng Ho | M | 69 | 32 anni | |
| Cai Ping Yang | F | - | - | |
| Guang Zhi Li | M | - |
Huatian Technology (Kunshan) Electronics Co. Ltd.
Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | - |
| Liu Jun Li | M | 52 | 11 anni | |
| Wen Bo Zhang | M | - |
Huatian Technology (Kunshan) Electronics Co. Ltd.
Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | - |
| Andy Ding | M | - |
Huatian Technology (Kunshan) Electronics Co. Ltd.
Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | - |
| Martin Wang | M | - |
Huatian Technology (Kunshan) Electronics Co. Ltd.
Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | - |
| Sam Hu | M | - |
Huatian Technology (Kunshan) Electronics Co. Ltd.
Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | - |
| Hui Fang Kuan | F | 53 | 4 anni | |
| Steve K. Chen | M | - |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | - |
| Jhet-Wern Chia | M | 44 | 20 anni | |
| Kim Heng Tan | M | 71 | 21 anni | |
| Jian Jun Chen | M | 57 |
Huatian Technology (Kunshan) Electronics Co. Ltd.
Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | 13 anni |
| Yu Ming Zhang | M | 61 | 11 anni | |
| Jian Jun Liu | M | 55 | 17 anni | |
| Janine Schmitz | F | - |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | - |
| Bruce Bowers | M | - |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | - |
| Hua Bing Luo | M | 61 | 17 anni | |
| Qin Qin Xu | F | 42 | 1 anni |
Grafico relazionale
Relazione in diverse aziende
Relazioni precedenti
| Nome | Sesso | Età | Società collegate | Collaborazione |
|---|---|---|---|---|
| Yong Shou Zhou | M | 57 | 3 anni | |
| Bin Cai Chen | M | 59 | - | |
| Zhao Sheng Meng | M | 62 | - | |
| Guang Seng Wong | M | 73 | 9 anni | |
| Mahani binti Amat | F | 70 | 5 anni | |
| Jing Xin Teng | M | 80 | 3 anni | |
| Wei Xiaoli | F | 38 | 2 anni | |
| Woon Yen | M | 77 | 28 anni | |
| Yan Tong Xue | M | 60 | - | |
| Heng Fatt Chua | M | 74 | 31 anni | |
| Shutao Wu | M | 42 | - |
Statistiche
| Paese | Relazioni | % del totale |
|---|---|---|
| Cina | 26 | 50.00% |
| Malesia | 23 | 44.23% |
| Stati Uniti | 5 | 9.62% |
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