Bao Zeng Wang

Direttore/Membro del Consiglio presso Henghui Technology Corp. Ltd.

41 anni

Producer Manufacturing

Consumer Services

Profilo

Bao Zeng Wang is currently a Member-Supervisory Board at HENGHUI Technology Corp.
Ltd.
His education history includes being a graduate from Southeast University.

Posizioni attive di Bao Zeng Wang

Società	Posizione	Inizio
Henghui Technology Corp. Ltd. Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.	Direttore/Membro del Consiglio	01/11/2020

Tutte le posizioni attive di Bao Zeng Wang

Formazione di Bao Zeng Wang

Southeast University

Graduate Degree

Esperienze
Posizioni ricoperte

Attive

Inattive

Società quotate in Borsa

Aziende private

Vedi nel dettaglio l'esperienza di Bao Zeng Wang

Relazioni

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Uomo

Donna

Amministratori

Dirigenti

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Società collegate

Aziende private	1
Henghui Technology Corp. Ltd. Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China.	Producer Manufacturing