Bin Li
Direttore/Membro del Consiglio presso Henghui Technology Corp. Ltd.
Profilo
Bin Li currently works at HENGHUI Technology Corp.
Ltd., as Director from 2020.
Mr. Li received his graduate degree from Tsinghua University.
Posizioni attive di Bin Li
| Società | Posizione | Inizio |
|---|---|---|
Henghui Technology Corp. Ltd.
 Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Direttore/Membro del Consiglio | 01/11/2020 |
Formazione di Bin Li
| Tsinghua University | Graduate Degree |
Esperienze
Posizioni ricoperte
Relazioni
Relazioni di 1° grado
Aziende connesse in 1º grado
Uomo
Donna
Amministratori
Dirigenti
Società collegate
| Aziende private | 1 |
|---|---|
Henghui Technology Corp. Ltd.
Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Producer Manufacturing |
- Borsa valori
- Insiders
- Bin Li
