Bin Li
Direttore/Membro del Consiglio presso Henghui Technology Corp. Ltd.
Posizioni attive di Bin Li
| Società | Posizione | Inizio | Fine |
|---|---|---|---|
Henghui Technology Corp. Ltd.
 Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Direttore/Membro del Consiglio | 01/11/2020 | - |
Storia della carriera di Bin Li
Formazione di Bin Li
| Tsinghua University | Graduate Degree |
Statistiche
Distribuzione geografica
| Cina | 3 |
Posizioni
| Director/Board Member | 1 |
| Graduate Degree | 1 |
Settori
| Producer Manufacturing | 2 |
| Consumer Services | 2 |
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Società collegate
| Aziende private | 1 |
|---|---|
Henghui Technology Corp. Ltd.
Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Producer Manufacturing |
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