Charles Whyte
Corporate Officer/Principal presso Vertical Circuits, Inc.
Posizioni attive di Charles Whyte
| Società | Posizione | Inizio | Fine |
|---|---|---|---|
Vertical Circuits, Inc.
 Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Corporate Officer/Principal | - | - |
Storia della carriera di Charles Whyte
Precedenti posizioni note di Charles Whyte
| Società | Posizione | Inizio | Fine |
|---|---|---|---|
| SANDISK CORPORATION | Corporate Officer/Principal | - | - |
Formazione di Charles Whyte
| The University of Edinburgh | Graduate Degree |
| Santa Clara University | Masters Business Admin |
Statistiche
Distribuzione geografica
| Stati Uniti | 4 |
| Regno Unito | 2 |
Posizioni
| Corporate Officer/Principal | 2 |
| Graduate Degree | 1 |
| Masters Business Admin | 1 |
Settori
| Electronic Technology | 3 |
| Consumer Services | 3 |
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Società collegate
| Aziende private | 2 |
|---|---|
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Electronic Technology |
SanDisk LLC
 SanDisk LLC Computer PeripheralsElectronic Technology SanDisk LLC designs, develops and markets flash memory data storage products. The company was founded by Eli Harari and Sanjay Mehrotra on June 01, 1988 and is headquartered in Irvine, CA. | Electronic Technology |
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