![Clay Byron Simpson](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Clay Byron Simpson
Nessuna posizione attualmente
Profilo
Clay Byron Simpson has been Vice President and General Counsel of Sirenza Microdevices, Inc. since March 2005 and was appointed Secretary in April 2005.
Prior to joining Sirenza, he served as an Associate Attorney with the law firm of Wilson Sonsini Goodrich & Rosati PC from October 1997 to February 2005.
Mr. Simpson received a BA from the University of California at Los Angeles and a JD from Columbia University.
Precedenti posizioni note di Clay Byron Simpson
Società | Posizione | Fine |
---|---|---|
Sirenza Microdevices, Inc.
![]() Sirenza Microdevices, Inc. Electronic Production EquipmentElectronic Technology Sirenza Microdevices, an ISO 9001:2000-certified supplier (registered by QMI), is a designer and supplier of high-performance RF components for wireless and wireline communications equipment manufacturers. Their product lines include amplifiers, power amplifiers, discrete devices, RF signal processing components, and signal source products, mil/aero components, and high-performance multi-component modules (MCMs) for transmit and receive applications. | Consigliere Generale | 17/11/2008 |
Formazione di Clay Byron Simpson
University of California, Berkeley | Undergraduate Degree |
The Trustees of Columbia University in The City of New York | Graduate Degree |
Esperienze
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Relazioni
Relazioni di 1° grado
Aziende connesse in 1º grado
Uomo
Donna
Amministratori
Dirigenti
Società collegate
Aziende private | 1 |
---|---|
Sirenza Microdevices, Inc.
![]() Sirenza Microdevices, Inc. Electronic Production EquipmentElectronic Technology Sirenza Microdevices, an ISO 9001:2000-certified supplier (registered by QMI), is a designer and supplier of high-performance RF components for wireless and wireline communications equipment manufacturers. Their product lines include amplifiers, power amplifiers, discrete devices, RF signal processing components, and signal source products, mil/aero components, and high-performance multi-component modules (MCMs) for transmit and receive applications. | Electronic Technology |
- Borsa valori
- Insiders
- Clay Byron Simpson