Ling Man Pan
Direttore/Membro del Consiglio presso Shenzhen Cau Technology Co. Ltd. /Shenzhen/
Posizioni attive di Ling Man Pan
| Società | Posizione | Inizio | Fine |
|---|---|---|---|
| Shenzhen Cau Technology Co. Ltd. /Shenzhen/ | Direttore/Membro del Consiglio | 01/02/2011 | - |
| Independent Dir/Board Member | - | - |
Storia della carriera di Ling Man Pan
Precedenti posizioni note di Ling Man Pan
| Società | Posizione | Inizio | Fine |
|---|---|---|---|
| SHENZHEN WOTE ADVANCED MATERIALS CO.,LTD | Direttore/Membro del Consiglio | 15/05/2018 | 09/04/2021 |
| Independent Dir/Board Member | 15/05/2018 | 09/04/2021 | |
| SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD. | Direttore/Membro del Consiglio | - | - |
| SHENZHEN DANBOND TECHNOLOGY CO.,LTD. | Direttore/Membro del Consiglio | - | - |
| Independent Dir/Board Member | - | - | |
| SHENZHEN COSHIP ELECTRONICS CO., LTD. | Direttore/Membro del Consiglio | 20/11/2009 | - |
| Independent Dir/Board Member | 20/11/2009 | - |
Formazione di Ling Man Pan
| Renmin University of China | Masters Business Admin |
| Wuhan Finance School | Undergraduate Degree |
Statistiche
Distribuzione geografica
| Cina | 8 |
Posizioni
| Director/Board Member | 5 |
| Independent Dir/Board Member | 4 |
| Masters Business Admin | 1 |
Settori
| Electronic Technology | 3 |
| Consumer Services | 3 |
| Health Technology | 2 |
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Società collegate
| Società quotate in Borsa | 3 |
|---|---|
| SHENZHEN COSHIP ELECTRONICS CO., LTD. | Electronic Technology |
| SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD. | Health Technology |
| SHENZHEN WOTE ADVANCED MATERIALS CO.,LTD | Process Industries |
| Aziende private | 2 |
|---|---|
| Shenzhen Cau Technology Co. Ltd. /Shenzhen/ | |
Shenzhen Danbond Technology Co., Ltd.
 Shenzhen Danbond Technology Co., Ltd. Electronic ComponentsElectronic Technology Shenzhen Danbond Technology Co., Ltd. engages in the research, development, production, and sale of flexible circuits and related materials. Its products include flexible printed circuits (FPC), chip-on-flex (COF) flexible packaging substrates, and COF products. The company was founded by Ping Liu on November 20, 2001 and is headquartered in Shenzhen, China. | Electronic Technology |
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