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Yu Gun Gao
Direttore/Membro del Consiglio presso Henghui Technology Corp. Ltd.
Posizioni attive di Yu Gun Gao
Società | Posizione | Inizio | Fine |
---|---|---|---|
Henghui Technology Corp. Ltd.
![]() Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Direttore/Membro del Consiglio | 01/11/2020 | - |
Independent Dir/Board Member | 01/11/2020 | - | |
PanPass Information Technology Co., Ltd.
![]() PanPass Information Technology Co., Ltd. Miscellaneous Commercial ServicesCommercial Services PanPass Information Technology Co., Ltd. provides digital identity tracing and management services for product lifecycles to its customers. It also offers technical services as well as develops and sells software products. The company was founded on November 15, 2002 and is headquartered in Beijing, China. | Direttore/Membro del Consiglio | 11/04/2023 | - |
Independent Dir/Board Member | 11/04/2023 | - |
Storia della carriera di Yu Gun Gao
Formazione di Yu Gun Gao
Beijing Precision Engineering Institute For Aircraft Industry | Graduate Degree |
Statistiche
Distribuzione geografica
Cina | 4 |
Posizioni
Director/Board Member | 2 |
Independent Dir/Board Member | 2 |
Graduate Degree | 1 |
Settori
Producer Manufacturing | 2 |
Consumer Services | 2 |
Commercial Services | 2 |
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Società collegate
Società quotate in Borsa | 1 |
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![]() | Commercial Services |
Aziende private | 1 |
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Henghui Technology Corp. Ltd.
![]() Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Producer Manufacturing |
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