Bing Feng Hu
Direttore Tecnico/Scientifico/R&S presso CIMS Suzhou Co., Ltd.
Profilo
Bing Feng Hu currently works at CIMS Suzhou Co., Ltd., as Manager-Research & Development from 2014.
Mr. Hu received his graduate degree from École Nationale Supérieure d'Ingénieurs de Caen.
Posizioni attive di Bing Feng Hu
| Società | Posizione | Inizio |
|---|---|---|
CIMS Suzhou Co., Ltd.
 CIMS Suzhou Co., Ltd. Electronic ComponentsElectronic Technology CIMS Suzhou Co., Ltd. provides automated optical inspection solutions dedicated to enhancing production processes and yield in printed circuit board (PCB), high density interconnect PCB (HDI PCB), flex and rigid-flex PCB and IC substrates. The company offers automated optical inspection, automated visual/final inspection (AVI/AFI), smart factory solution, high density interconnect PCB, IC substrate, multi-layer PCB, flex PCB and special applications. CIMS Suzhou was founded in 2005 and is headquartered in Suzhou, China. | Direttore Tecnico/Scientifico/R&S | 01/01/2014 |
Formazione di Bing Feng Hu
| École Nationale Supérieure d'Ingénieurs de Caen | Graduate Degree |
Esperienze
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Relazioni
Relazioni di 1° grado
Aziende connesse in 1º grado
Uomo
Donna
Amministratori
Dirigenti
Società collegate
| Aziende private | 1 |
|---|---|
CIMS Suzhou Co., Ltd.
CIMS Suzhou Co., Ltd. Electronic ComponentsElectronic Technology CIMS Suzhou Co., Ltd. provides automated optical inspection solutions dedicated to enhancing production processes and yield in printed circuit board (PCB), high density interconnect PCB (HDI PCB), flex and rigid-flex PCB and IC substrates. The company offers automated optical inspection, automated visual/final inspection (AVI/AFI), smart factory solution, high density interconnect PCB, IC substrate, multi-layer PCB, flex PCB and special applications. CIMS Suzhou was founded in 2005 and is headquartered in Suzhou, China. | Electronic Technology |
- Borsa valori
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- Bing Feng Hu
