David McComb
Vendite & Marketing presso FlipChip International LLC
Provenienza dei contatti di primo grado di David McComb
| Entità | Tipo di entità | Settore Industriale | |
|---|---|---|---|
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ.
12
| Subsidiary | Semiconductors | 12 |
Grafico delle società connesse in secondo grado
Relazione in diverse aziende
Società connesse a David McComb tramite i suoi contatti personali
| Società | Settore | Persone collegate | Posizione principale |
|---|---|---|---|
| SUNEDISON INC | Alternative Power Generation | Corporate Officer/Principal | |
eGTran Corp.
 eGTran Corp. SemiconductorsElectronic Technology eGTran Corp. designs and supplies high-performance broadband connectivity products. The company’s products are used throughout the long haul, metro and access networks, across cable, satellite, telecommunications, data-communications and wireless communications networks. It serves multimedia wireless and fiber optic communication technology industries. eGTran was founded by Frank S. Lee in September 2006 and is headquartered in Taipei, Taiwan. | Semiconductors | Chairman | |
| UNISEM (M) | Semiconductors | Director/Board Member | |
| National University of Singapore | College/University | Undergraduate Degree | |
| SERCOMM CORPORATION | Telecommunications Equipment | Director/Board Member | |
| Adelphi University | College/University | Masters Business Admin | |
| EZCONN CORPORATION | Electronic Components | Chairman | |
| The University of Edinburgh | College/University | Undergraduate Degree | |
| Fudan University | College/University | Doctorate Degree | |
| TIANSHUI HUATIAN TECHNOLOGY CO., LTD. | Semiconductors | Director/Board Member | |
Xiamen Yonghong Group Co. Ltd.
 Xiamen Yonghong Group Co. Ltd. SemiconductorsElectronic Technology Xiamen Yonghong Group Co., Ltd. manufactures and distributes semi conductor lead frames. It also provides precise tooling products. The company distributes products to United States and other European countries. Xiamen Yonghong Group is located in Xiamen, China | Semiconductors | Corporate Officer/Principal | |
AGC Multi Material America, Inc.
 AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Electronic Components | President | |
Huatian Technology (Kunshan) Electronics Co. Ltd.
 Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | Electronic Production Equipment | Chief Executive Officer | |
| Harvard Law School | College/University | Graduate Degree | |
| SHC Consolidated Investors LLC | Chairman | ||
| Spatial Digital Systems, Inc. | Director/Board Member | ||
| Trimax & Cos. Llc | Chairman | ||
| Stembios Technologies, Inc. | Director/Board Member | ||
Unisem Advanced Technologies Sdn. Bhd.
 Unisem Advanced Technologies Sdn. Bhd. SemiconductorsElectronic Technology Unisem Advanced Technologies Sdn. Bhd. manufactures electron tubes and semiconductors. Its services include gold bumping, electroplated solder bumping, electroplated copper pillar bumping, large solder bumping, PBO, polyimides & BCB passivation, redistribution of bond pads and in-house photo mask and stencil design capability. The company was founded on September 13, 2004 and is headquartered in Perak, Malaysia. | Semiconductors | Director/Board Member | |
| FTC SOLAR, INC. | Packaged Software | Corporate Officer/Principal | |
| Dna Asset Management LLC | Chairman |
Statistiche
Distribuzione geografica
| Stati Uniti | 11 |
| Cina | 5 |
| Taiwan | 4 |
| Malesia | 3 |
| Singapore | 2 |
Settori
| Electronic Technology | 10 |
| Consumer Services | 6 |
| Utilities | 2 |
| Technology Services | 2 |
Posizioni
| Director/Board Member | 8 |
| Corporate Officer/Principal | 5 |
| Chairman | 5 |
| Chief Executive Officer | 3 |
| President | 3 |
Contatti più connessi
| Insiders | |
|---|---|
| Steve K. Chen | 10 |
| Zhi Yi Xiao | 8 |
| Jay B. Grover | 4 |
| Kay Lui Weng | 2 |
| David Wilkie | 2 |
| Bob Forcier | 1 |
| Ted Tessier | 1 |
| Bruce Bowers | 1 |
| Janine Schmitz | 1 |
| Marcus Crayon | 1 |
| Greg Marshall | 1 |
| Dawn Cuevas | 1 |
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