Jay B. Grover
Nessuna posizione attualmente
Profilo
Jay B.
Grover worked as a Senior Director-Global Logistics at SunEdison, Inc. from 2010 to 2017.
Prior to that, he was the Chief Operations Officer at FlipChip International LLC from 2005 to 2010 and the President at AGC Multi Material America, Inc. from 1997 to 2005.
He also worked as the Vice President-Supply Chain at FTC Solar, Inc. from 2019 to 2021.
Precedenti posizioni note di Jay B. Grover
| Società | Posizione | Fine |
|---|---|---|
| FTC SOLAR, INC. | Corporate Officer/Principal | 27/08/2021 |
| SUNEDISON INC | Corporate Officer/Principal | 01/01/2017 |
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Direttore operativo | 01/01/2010 |
AGC Multi Material America, Inc.
 AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Presidente | 01/01/2005 |
Esperienze
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Relazioni
Relazioni di 1° grado
Aziende connesse in 1º grado
Uomo
Donna
Amministratori
Dirigenti
Società collegate
| Società quotate in Borsa | 1 |
|---|---|
| FTC SOLAR, INC. | Technology Services |
| Aziende private | 3 |
|---|---|
SunEdison, Inc.
 SunEdison, Inc. Alternative Power GenerationUtilities SunEdison, Inc. engages in the provision of renewable-energy services. The company was founded on August 6, 1959 and is headquartered in Maryland Beltsville, MD. | Utilities |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Electronic Technology |
AGC Multi Material America, Inc.
AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Electronic Technology |
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