Lewis Hwan

Presidente presso Mutual-Pak Technology Co., Ltd.

Electronic Technology

Relazioni attive

Nome	Sesso	Età	Società collegate	Collaborazione
Juine Kai Tsang	M	-	Mutual-Pak Technology Co., Ltd. Mutual-Pak Technology Co., Ltd. Electronic Production EquipmentElectronic Technology Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan.	-
Wei Peng Lin	M	-	Mutual-Pak Technology Co., Ltd. Mutual-Pak Technology Co., Ltd. Electronic Production EquipmentElectronic Technology Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan.	-
Shi-Sung Huang	M	-	Mutual-Pak Technology Co., Ltd. Mutual-Pak Technology Co., Ltd. Electronic Production EquipmentElectronic Technology Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan.	-
Chia Fred	M	-	Mutual-Pak Technology Co., Ltd. Mutual-Pak Technology Co., Ltd. Electronic Production EquipmentElectronic Technology Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan.	-