Ming Hsien Chen

Director/Board Member presso EIRGENIX INC.

Consumer Services

Electronic Technology

Health Technology

Profilo

Ming Hsien Chen is currently an Independent Director at Kingpak Technology, Inc. and EirGenix, Inc. He is also a Professor at National Taiwan University.
Previously, he served as a Director-Supervisory Board at Kingpak Technology, Inc. Chen holds a doctorate degree from Michigan State University and undergraduate and graduate degrees from National Taiwan University.

Posizioni attive di Ming Hsien Chen

Società	Posizione	Inizio
EIRGENIX INC.	Director/Board Member	13/09/2016
KINGPAK TECHNOLOGY INC.	Director/Board Member	31/05/2016
National Taiwan University	Corporate Officer/Principal	24/10/2011

Tutte le posizioni attive di Ming Hsien Chen

Precedenti posizioni note di Ming Hsien Chen

Società	Posizione	Fine
Kingpak Technology, Inc. /Old/ Kingpak Technology, Inc. /Old/ Electronic Production EquipmentElectronic Technology Kingpak Technology, Inc. (GR: 8172) is an independent Taiwan-based firm which provides integrated circuit package assembly services. Their products include ball grid array, secure digital card, multimedia card, compact camera module, and plastic leaded chip carrier. The firm was founded in 1997 and is headquartered in Chu-Pei, Taiwan.	Director/Board Member	-

Vedi nel dettaglio l'esperienza di Ming Hsien Chen

Formazione di Ming Hsien Chen

Michigan State University	Doctorate Degree
National Taiwan University	Graduate Degree

Esperienze
Posizioni ricoperte

Attive

Inattive

Società quotate in Borsa

Aziende private

Vedi nel dettaglio l'esperienza di Ming Hsien Chen

Relazioni

100 +

Relazioni di 1° grado

Aziende connesse in 1º grado

Uomo

Donna

Amministratori

Dirigenti

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Società collegate

Società quotate in Borsa	1
EIRGENIX INC.	Health Technology

Aziende private	2
Kingpak Technology, Inc. /Old/ Kingpak Technology, Inc. /Old/ Electronic Production EquipmentElectronic Technology Kingpak Technology, Inc. (GR: 8172) is an independent Taiwan-based firm which provides integrated circuit package assembly services. Their products include ball grid array, secure digital card, multimedia card, compact camera module, and plastic leaded chip carrier. The firm was founded in 1997 and is headquartered in Chu-Pei, Taiwan.	Electronic Technology
Kingpak Technology, Inc. Kingpak Technology, Inc. SemiconductorsElectronic Technology Kingpak Technology, Inc. engages in the testing and sale of complementary metal-oxide semiconductor (CMOS) image sensor, CMOS image sensors (CIS) and integrated circuit packaging. It mainly focuses on consumer products, wearable products, safety monitoring & automobile related CIS packaging as well as video testing services. The company's products include CMOS image sensor, micro-electro-mechanical systems (MEMS), ball grid array (BGA), and system in package (SiP). Kingpak Technology was founded on May 8, 1991 and is headquartered in Taipei, Taiwan.	Electronic Technology