Zhi Yi Xiao
Direttore/Membro del Consiglio presso UNISEM (M)
Profilo
Dr. Zhi Yi Xiao is a General Manager at Huatian Technology (Kunshan) Electronics Co. Ltd.
He is on the Board of Directors at Tianshui Huatian Technology Co., Ltd., Unisem (M) Bhd., FlipChip International LLC and Unisem Advanced Technologies Sdn.
Bhd.
Dr. Xiao was previously employed as a General Manager by Xiamen Yonghong Group Co. Ltd.
He received his MBA from Adelphi University and a doctorate degree from Fudan University.
Posizioni attive di Zhi Yi Xiao
Società | Posizione | Inizio |
---|---|---|
UNISEM (M) | Direttore/Membro del Consiglio | 30/01/2019 |
TIANSHUI HUATIAN TECHNOLOGY CO., LTD. | Direttore/Membro del Consiglio | 21/05/2019 |
Huatian Technology (Kunshan) Electronics Co. Ltd.
Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | Amministratore Delegato | 01/01/2013 |
Unisem Advanced Technologies Sdn. Bhd.
Unisem Advanced Technologies Sdn. Bhd. SemiconductorsElectronic Technology Unisem Advanced Technologies Sdn. Bhd. manufactures electron tubes and semiconductors. Its services include gold bumping, electroplated solder bumping, electroplated copper pillar bumping, large solder bumping, PBO, polyimides & BCB passivation, redistribution of bond pads and in-house photo mask and stencil design capability. The company was founded on September 13, 2004 and is headquartered in Perak, Malaysia. | Direttore/Membro del Consiglio | - |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Direttore/Membro del Consiglio | - |
Precedenti posizioni note di Zhi Yi Xiao
Società | Posizione | Fine |
---|---|---|
Xiamen Yonghong Group Co. Ltd.
Xiamen Yonghong Group Co. Ltd. SemiconductorsElectronic Technology Xiamen Yonghong Group Co., Ltd. manufactures and distributes semi conductor lead frames. It also provides precise tooling products. The company distributes products to United States and other European countries. Xiamen Yonghong Group is located in Xiamen, China | Corporate Officer/Principal | 01/01/2009 |
Formazione di Zhi Yi Xiao
Fudan University | Doctorate Degree |
Adelphi University | Masters Business Admin |
Esperienze
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Relazioni
Relazioni di 1° grado
Aziende connesse in 1º grado
Uomo
Donna
Amministratori
Dirigenti
Società collegate
Società quotate in Borsa | 2 |
---|---|
UNISEM (M) | Electronic Technology |
TIANSHUI HUATIAN TECHNOLOGY CO., LTD. | Electronic Technology |
Aziende private | 4 |
---|---|
Huatian Technology (Kunshan) Electronics Co. Ltd.
Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | Electronic Technology |
Xiamen Yonghong Group Co. Ltd.
Xiamen Yonghong Group Co. Ltd. SemiconductorsElectronic Technology Xiamen Yonghong Group Co., Ltd. manufactures and distributes semi conductor lead frames. It also provides precise tooling products. The company distributes products to United States and other European countries. Xiamen Yonghong Group is located in Xiamen, China | Electronic Technology |
Unisem Advanced Technologies Sdn. Bhd.
Unisem Advanced Technologies Sdn. Bhd. SemiconductorsElectronic Technology Unisem Advanced Technologies Sdn. Bhd. manufactures electron tubes and semiconductors. Its services include gold bumping, electroplated solder bumping, electroplated copper pillar bumping, large solder bumping, PBO, polyimides & BCB passivation, redistribution of bond pads and in-house photo mask and stencil design capability. The company was founded on September 13, 2004 and is headquartered in Perak, Malaysia. | Electronic Technology |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Electronic Technology |
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- Insiders
- Zhi Yi Xiao