Ling Man Pan
Direttore/Membro del Consiglio presso Shenzhen Cau Technology Co. Ltd. /Shenzhen/
Profilo
Ling Man Pan currently holds a position as an Independent Director at Shenzhen Cau Technology Co. Ltd.
In the past, Ms. Pan has held positions as an Independent Director at Shenzhen Coship Electronics Co., Ltd., Shenzhen Salubris Pharmaceuticals Co., Ltd., and Shenzhen Danbond Technology Co., Ltd.
Ms. Pan also served as an Independent Director at Shenzhen Wote Advanced Materials Co., Ltd.
from 2018 to 2021.
Ms. Pan has a Master's in Business Administration from Renmin University of China and an undergraduate degree from Wuhan Finance School, which was conferred in 1968.
Posizioni attive di Ling Man Pan
| Società | Posizione | Inizio |
|---|---|---|
| Shenzhen Cau Technology Co. Ltd. /Shenzhen/ | Direttore/Membro del Consiglio | 01/02/2011 |
Precedenti posizioni note di Ling Man Pan
| Società | Posizione | Fine |
|---|---|---|
| SHENZHEN WOTE ADVANCED MATERIALS CO.,LTD | Direttore/Membro del Consiglio | 09/04/2021 |
| SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD. | Direttore/Membro del Consiglio | - |
| SHENZHEN DANBOND TECHNOLOGY CO.,LTD. | Direttore/Membro del Consiglio | - |
| SHENZHEN COSHIP ELECTRONICS CO., LTD. | Direttore/Membro del Consiglio | - |
Formazione di Ling Man Pan
| Renmin University of China | Masters Business Admin |
| Wuhan Finance School | Undergraduate Degree |
Esperienze
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Relazioni
Relazioni di 1° grado
Aziende connesse in 1º grado
Uomo
Donna
Amministratori
Dirigenti
Società collegate
| Società quotate in Borsa | 3 |
|---|---|
| SHENZHEN COSHIP ELECTRONICS CO., LTD. | Electronic Technology |
| SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD. | Health Technology |
| SHENZHEN WOTE ADVANCED MATERIALS CO.,LTD | Process Industries |
| Aziende private | 2 |
|---|---|
| Shenzhen Cau Technology Co. Ltd. /Shenzhen/ | |
Shenzhen Danbond Technology Co., Ltd.
 Shenzhen Danbond Technology Co., Ltd. Electronic ComponentsElectronic Technology Shenzhen Danbond Technology Co., Ltd. engages in the research, development, production, and sale of flexible circuits and related materials. Its products include flexible printed circuits (FPC), chip-on-flex (COF) flexible packaging substrates, and COF products. The company was founded by Ping Liu on November 20, 2001 and is headquartered in Shenzhen, China. | Electronic Technology |
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- Ling Man Pan
