Patty Winters
Direttore Amministrativo presso Vertical Circuits, Inc.
Profilo
Patty Winters is currently the Vice President-Administration & Human Resources at Vertical Circuits, Inc. since 2004.
Prior to this, she worked as the Operations Director at Parallax Medical, Inc. from 2000 to 2003.
Posizioni attive di Patty Winters
Società | Posizione | Inizio |
---|---|---|
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Direttore Amministrativo | 01/01/2004 |
Precedenti posizioni note di Patty Winters
Società | Posizione | Fine |
---|---|---|
Parallax Medical, Inc. | Direttore operativo | 01/01/2003 |
Esperienze
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Relazioni
Relazioni di 1° grado
Aziende connesse in 1º grado
Uomo
Donna
Amministratori
Dirigenti
Società collegate
Aziende private | 2 |
---|---|
Vertical Circuits, Inc.
Vertical Circuits, Inc. SemiconductorsElectronic Technology Vertical Circuits Inc. is a global supplier of advanced die level vertical interconnect packaging technology, products, services and intellectual property for the manufacture of low-cost, ultra high-speed/high-density semiconductor components. They develop cost effective advanced interconnect technology for high density and high performance applications. Its patented ViP™ (vertical interconnect pillar) process bridges the gap between current wire bond based product solutions and tomorrow's through silicon via technology. They enable packaging solutions for Memory and Mixed Die applications including a broad range of server, networking & handheld portable consumer electronics systems products. | Electronic Technology |
Parallax Medical, Inc. |
- Borsa valori
- Insiders
- Patty Winters