Samuel d'Hollosy

Hightec MC AG manufactures and distributes circuits and interconnection cables. It specializes in development and production of thin films on substrates and LTCC, submounts for optoelectronics, multilayer circuits, flexible RF cables and interconnections, and packaging of dies, sensors and MEMS. The company’s products include HiCoFlex, MCM-D, hybrids, substrates, resistor networks, sensors, and optoelectronic components. Its services include design, thin films, photolithography, assembly, burn-in and testing, and packaging. Hightec MC was founded in 1992 and is headquartered in Lenzburg, Switzerland.

Hightec MC AG manufactures and distributes circuits and interconnection cables. It specializes in development and production of thin films on substrates and LTCC, submounts for optoelectronics, multilayer circuits, flexible RF cables and interconnections, and packaging of dies, sensors and MEMS. The company’s products include HiCoFlex, MCM-D, hybrids, substrates, resistor networks, sensors, and optoelectronic components. Its services include design, thin films, photolithography, assembly, burn-in and testing, and packaging. Hightec MC was founded in 1992 and is headquartered in Lenzburg, Switzerland.

Hightec MC AG manufactures and distributes circuits and interconnection cables. It specializes in development and production of thin films on substrates and LTCC, submounts for optoelectronics, multilayer circuits, flexible RF cables and interconnections, and packaging of dies, sensors and MEMS. The company’s products include HiCoFlex, MCM-D, hybrids, substrates, resistor networks, sensors, and optoelectronic components. Its services include design, thin films, photolithography, assembly, burn-in and testing, and packaging. Hightec MC was founded in 1992 and is headquartered in Lenzburg, Switzerland.