Hsiu-Ying Chiu
Corporate Officer/Principal presso SHIN FOONG SPECIALTY AND APPLIED MATERIALS CO., LTD.
Posizioni attive di Hsiu-Ying Chiu
| Società | Posizione | Inizio | Fine |
|---|---|---|---|
| SHIN FOONG SPECIALTY AND APPLIED MATERIALS CO., LTD. | Corporate Officer/Principal | 22/09/2022 | - |
| Presidente | 25/07/2015 | 22/09/2022 |
Storia della carriera di Hsiu-Ying Chiu
Precedenti posizioni note di Hsiu-Ying Chiu
| Società | Posizione | Inizio | Fine |
|---|---|---|---|
| TAIGEN BIOPHARMACEUTICALS HOLDINGS LIMITED | Direttore/Membro del Consiglio | 29/04/2013 | 17/12/2018 |
| CHUNG HWA PULP CORPORATION | Direttore/Membro del Consiglio | 08/09/2010 | - |
| BOARDTEK ELECTRONICS CORP | Direttore/Membro del Consiglio | 08/09/2010 | - |
| YFY INC. | Direttore/Membro del Consiglio | 23/06/2006 | - |
| Presidente | 23/06/2006 | - | |
| Direttore Finanziario/CFO | 23/06/2006 | - |
Formazione di Hsiu-Ying Chiu
| University of Pittsburgh | Doctorate Degree |
| Carnegie Mellon University | Doctorate Degree |
| National Taiwan University | Doctorate Degree |
Statistiche
Distribuzione geografica
| Taiwan | 7 |
| Stati Uniti | 3 |
Posizioni
| Director/Board Member | 4 |
| Doctorate Degree | 3 |
| Chairman | 2 |
Settori
| Process Industries | 4 |
| Consumer Services | 4 |
| Electronic Technology | 2 |
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Società collegate
| Società quotate in Borsa | 4 |
|---|---|
| YFY INC. | Process Industries |
| CHUNG HWA PULP CORPORATION | Process Industries |
| TAIGEN BIOPHARMACEUTICALS HOLDINGS LIMITED | Health Technology |
| SHIN FOONG SPECIALTY AND APPLIED MATERIALS CO., LTD. | Process Industries |
| Aziende private | 1 |
|---|---|
BoardTek Electronics Corp.
 BoardTek Electronics Corp. Electronic ComponentsElectronic Technology BoardTek Electronics Corp. engages in the design, manufacture, and sale of multilayer PCB, single & double-sided PCB, and electronic components. Its products include PCB products, integrated circuit (IC) substrate, and green process and system integration. The PCB products cover high speed digital PCB, high frequency microwave PCB, pre-bond metal PCB, post-bonding metal PCB, coin insertion and embedding, ceramic substrate embedded PCB, and heavy copper PCB. The IC substrate covers flash and memory card substrate, complementary metal-oxide semiconductor (CMOS) image sensor substrate, and light-emitting diode (LED) Substrate. The green process and system integration covers high purity copper oxide, copper concentration control system, and insoluble anode. BoardTek Electronics was founded on June 8, 1987 and is headquartered in Taoyuan, Taiwan. | Electronic Technology |
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