![Yoshinori Tazoe](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Yoshinori Tazoe
Direttore/Membro del Consiglio presso Casio Micronics Co., Ltd.
Profilo
Yoshinori Tazoe currently works as a Director at Casio Micronics Co., Ltd.
Posizioni attive di Yoshinori Tazoe
Società | Posizione | Inizio |
---|---|---|
Casio Micronics Co., Ltd.
![]() Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | Direttore/Membro del Consiglio | 11/10/2011 |
Esperienze
Posizioni ricoperte
Attive
Inattive
Società quotate in Borsa
Aziende private
Relazioni
Relazioni di 1° grado
Aziende connesse in 1º grado
Uomo
Donna
Amministratori
Dirigenti
Società collegate
Aziende private | 1 |
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Casio Micronics Co., Ltd.
![]() Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | Electronic Technology |
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